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Austin Waterjet, Inc.
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Waterjet and Double Disk Ground Hoop For Semiconductor Equipment Manufacturer

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Waterjet and Double Disk Ground Hoop For Semiconductor Equipment Manufacturer
Waterjet and Double Disk Ground Hoop For Semiconductor Equipment Manufacturer
Waterjet and Double Disk Ground Hoop For Semiconductor Equipment Manufacturer
  Using a variety of processes, including laser cutting, annealing and double-disk grinding, our company was able to successfully manufacture a series of water jet and double disk ground hoops that were intended for use in semiconductor equipment.

Through our advanced laser cutting technology, we were able to manufacture semiconductor hoops that met precise client size, thickness, and flatness specifications. Each hoop measured ten inches in length and seven inches in width, and possessed a material thickness of .25 inches. And, through our innovative double-disk grinding machinery, we were able to uphold a (+/-) .002 inch precision tolerance and provide a thirty-two micro inch surface finish.

Through a variety of cost-efficient manufacturing processes, Austin Waterjet was able to produce precision semiconductor hoops that met high customer expectations and saved the client approximately $25 over traditional machining methods.

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Specifications

Capabilities Applied/Processes Laser Cutting, Annealing, Double Disk Grinding
Is it possible to machine this part? Yes
If so what is the savings with Laser Cutting
vs. machining
$25.00
Tightest Tolerance +/- 0.002 inch thickness, 0.002 inch flatness
Material Thickness 0.250 inches
Product Length 10 inches
Product Width 7 inches
Surface Roughness 32 microinch
Cutting Method Laser Cutting
Base Material 304 SS

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