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Waterjet Cut, Reamed and Tapped Side Plate for Semiconductor Equipment

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Waterjet Cut, Reamed and Tapped Side Plate for Semiconductor Equipment
Waterjet Cut, Reamed and Tapped Side Plate for Semiconductor Equipment
Waterjet Cut, Reamed and Tapped Side Plate for Semiconductor Equipment
  Recently contracted by a client to produce side plates intended for use on semi-conductor equipment, we incorporated a variety of production methods to ensure efficient, high-quality results. Using a combination of water jet cutting, tapping, reaming and edge break manufacturing processes, we were able to construct high-quality semi-conductor plates measuring five inches in length, 4.5 inches in width and 3/8 of an inch in thickness. And, using 304 stainless steel base material, we upheld a (+/-) .001 inch tolerance. Through a variety of advanced service capabilities, Austin Waterjet was able to design and build high-quality product that met with our client's unique specifications.

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Specifications

Capabilities Applied/Processes Waterjet, Tapping, Reaming, Edge Break, Vibratory Deburring
Tightest Tolerance +/- 0.001 inch (Reamed hole)
Material Thickness 3/8 inch
Product Length 5 inches
Product Width 4 ½ inch
Cutting Method Waterjet Cutting or Laser Cutting
Base Material 304 SS

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